JPH01107153U - - Google Patents
Info
- Publication number
- JPH01107153U JPH01107153U JP232488U JP232488U JPH01107153U JP H01107153 U JPH01107153 U JP H01107153U JP 232488 U JP232488 U JP 232488U JP 232488 U JP232488 U JP 232488U JP H01107153 U JPH01107153 U JP H01107153U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- brazed
- ceramic package
- standoff
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000005219 brazing Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP232488U JPH01107153U (en]) | 1988-01-12 | 1988-01-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP232488U JPH01107153U (en]) | 1988-01-12 | 1988-01-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01107153U true JPH01107153U (en]) | 1989-07-19 |
Family
ID=31202994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP232488U Pending JPH01107153U (en]) | 1988-01-12 | 1988-01-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01107153U (en]) |
-
1988
- 1988-01-12 JP JP232488U patent/JPH01107153U/ja active Pending